Signal Integrity - Simplified

by
Edition: 1st
Format: Hardcover
Pub. Date: 2004-01-01
Publisher(s): Prentice Hall
List Price: $109.00

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Summary

This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.

Table of Contents

Preface xiii
Signal Integrity Is in Your Future
1(40)
What Is Signal Integrity?
2(3)
Signal Quality on a Single Net
5(3)
Cross Talk
8(2)
Rail-Collapse Noise
10(3)
Electromagnetic Interference (EMI)
13(2)
Two Important Signal Integrity Generalizations
15(1)
Trends in Electronic Products
16(5)
The Need for a New Design Methodology
21(1)
A New Product Design Methodology
22(1)
Simulations
23(4)
Modeling and Models
27(2)
Creating Circuit Models from Calculation
29(5)
Three Types of Measurements
34(3)
The Role of Measurements
37(2)
The Bottom Line
39(2)
Time and Frequency Domains
41(38)
The Time Domain
42(2)
Sine Waves in the Frequency Domain
44(2)
Shorter Time to a Solution in the Frequency Domain
46(1)
Sine Wave Features
47(2)
The Fourier Transform
49(2)
The Spectrum of a Repetitive Signal
51(2)
The Spectrum of an Ideal Square Wave
53(2)
From the Frequency Domain to the Time Domain
55(1)
Effect of Bandwidth on Rise Time
56(3)
Bandwidth and Rise Time
59(2)
What Does ``Significant'' Mean?
61(3)
Bandwidth of Real Signals
64(2)
Bandwidth and Clock Frequency
66(2)
Bandwidth of a Measurement
68(2)
Bandwidth of a Model
70(1)
Bandwidth of an Interconnect
71(5)
The Bottom Line
76(3)
Impedance and Electrical Models
79(30)
Describing Signal-Integrity Solutions in Terms of Impedance
80(2)
What Is Impedance?
82(2)
Real vs. Ideal Circuit Elements
84(2)
Impedance of an Ideal Resistor in the Time Domain
86(1)
Impedance of an Ideal Capacitor in the Time Domain
87(3)
Impedance of an Ideal Inductor in the Time Domain
90(2)
Impedance in the Frequency Domain
92(5)
Equivalent Electrical Circuit Models
97(2)
Circuit Theory and SPICE
99(4)
Introduction to Modeling
103(5)
The Bottom Line
108(1)
The Physical Basis of Resistance
109(14)
Translating Physical Design into Electrical Performance
110(1)
The Only Good Approximation for the Resistance of Interconnects
111(3)
Bulk Resistivity
114(1)
Resistance per Length
115(2)
Sheet Resistance
117(4)
The Bottom Line
121(2)
The Physical Basis of Capacitance
123(24)
Current Flow in Capacitors
124(2)
The Capacitance of a Sphere
126(1)
Parallel Plate Approximation
127(2)
Dielectric Constant
129(1)
Power and Ground Planes and Decoupling Capacitance
130(4)
Capacitance per Length
134(5)
2D Field Solvers
139(3)
Effective Dielectric Constant
142(4)
The Bottom Line
146(1)
The Physical Basis of Inductance
147(58)
What Is Inductance?
147(1)
Inductance Principle #1: There Are Circular Magnetic-Field Line Loops Around All Currents
148(2)
Inductance Principle #2: Inductance Is the Number of Webers of Field Line Loops Around a Conductor per Amp of Current Through It
150(2)
Self-Inductance and Mutual Inductance
152(2)
Inductance Principle #3: When the Number of Field Line Loops Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor
154(3)
Partial Inductance
157(6)
Effective, Total, or Net Inductance and Ground Bounce
163(6)
Loop Self- and Mutual Inductance
169(5)
The Power-Distribution System (PDS) and Loop Inductance
174(5)
Loop Inductance per Square of Planes
179(2)
Loop Inductance of Planes and Via Contacts
181(2)
Loop Inductance of Planes with a Field of Clearance Holes
183(2)
Loop Mutual Inductance
185(1)
Equivalent Inductance
185(2)
Summary of Inductance
187(2)
Current Distributions and Skin Depth
189(9)
High-Permeability Materials
198(2)
Eddy Currents
200(2)
The Bottom Line
202(3)
The Physical Basis of Transmission Lines
205(72)
Forget the Word Ground
206(1)
The Signal
207(1)
Uniform Transmission Lines
208(2)
The Speed of Electrons in Copper
210(1)
The Speed of a Signal in a Transmission Line
211(4)
Spatial Extent of the Leading Edge
215(1)
``Be the Signal''
216(4)
The Instantaneous Impedance of a Transmission Line
220(3)
Characteristic Impedance and Controlled Impedance
223(2)
Famous Characteristic Impedances
225(3)
The Impedance of a Transmission Line
228(5)
Driving a Transmission Line
233(3)
Return Paths
236(4)
When Return Paths Switch Reference Planes
240(12)
A First-Order Model of a Transmission Line
252(5)
Calculating Characteristic Impedance with Approximations
257(4)
Calculating the Characteristic Impedance with a 2D Field Solver
261(5)
An n-Section Lumped Circuit Model
266(7)
Frequency Variation of the Characteristic Impedance
273(2)
The Bottom Line
275(2)
Transmission Lines and Reflections
277(56)
Reflections at Impedance Changes
278(2)
Why Are There Reflections?
280(3)
Reflections from Resistive Loads
283(3)
Source Impedance
286(2)
Bounce Diagrams
288(1)
Simulating Reflected Waveforms
289(3)
Measuring Reflections with a TDR
292(3)
Transmission Lines and Unintentional Discontinuities
295(2)
When to Terminate
297(3)
The Most Common Termination Strategy for Point-to-Point Topology
300(2)
Reflections from Short Series Transmission Lines
302(3)
Reflections from Short-Stub Transmission Lines
305(2)
Reflections from Capacitive End Terminations
307(3)
Reflections from Capacitive Loads in the Middle of a Trace
310(3)
Capacitive Delay Adders
313(2)
Effects of Corners and Vias
315(5)
Loaded Lines
320(3)
Reflections from Inductive Discontinuities
323(5)
Compensation
328(2)
The Bottom Line
330(3)
Lossy Lines, Rise-Time Degradation, and Material Properties
333(68)
Why Worry About Lossy Lines
334(2)
Losses in Transmission Lines
336(2)
Sources of Loss: Conductor Resistance and Skin Depth
338(4)
Sources of Loss: The Dielectric
342(5)
Dissipation Factor
347(3)
The Real Meaning of Dissipation Factor
350(5)
Modeling Lossy Transmission Lines
355(8)
Characteristic Impedance of a Lossy Transmission Line
363(2)
Signal Velocity in a Lossy Transmission Line
365(2)
Attenuation and the dB
367(5)
Attenuation in Lossy Lines
372(9)
Measured Properties of a Lossy Line in the Frequency Domain
381(5)
The Bandwidth of an Interconnect
386(6)
Time-Domain Behavior of Lossy Lines
392(4)
Improving the Eye Diagram of a Transmission Line
396(2)
Pre-emphasis and Equalization
398(1)
The Bottom Line
399(2)
Cross Talk in Transmission Lines
401(70)
Superposition
402(1)
Origin of Coupling: Capacitance and Inductance
403(2)
Cross Talk in Transmission Lines: NEXT and FEXT
405(2)
Describing Cross Talk
407(2)
The SPICE Capacitance Matrix
409(4)
The Maxwell Capacitance Matrix and 2D Field Solvers
413(6)
The Inductance Matrix
419(2)
Cross Talk in Uniform Transmission Lines and Saturation Length
421(5)
Capacitively Coupled Currents
426(4)
Inductively Coupled Currents
430(3)
Near-End Cross Talk
433(3)
Far-End Cross Talk
436(7)
Decreasing Far-End Cross Talk
443(2)
Simulating Cross Talk
445(7)
Guard Traces
452(7)
Cross Talk and Dielectric Constant
459(1)
Cross Talk and Timing
460(4)
Switching Noise
464(4)
Summary of Reducing Cross Talk
468(1)
The Bottom Line
468(3)
Differential Pairs and Differential Impedance
471(80)
Differential Signaling
472(4)
A Differential Pair
476(2)
Differential Impedance with No Coupling
478(4)
The Impact from Coupling
482(6)
Calculating Differential Impedance
488(4)
The Return-Current Distribution in a Differential Pair
492(6)
Odd and Even Modes
498(5)
Differential Impedance and Odd-Mode Impedance
503(1)
Common Impedance and Even-Mode Impedance
504(3)
Differential and Common Signals and Odd- and Even-Mode Voltage Components
507(2)
Velocity of Each Mode and Far-End Cross Talk
509(6)
Ideal Coupled Transmission-Line Model or an Ideal Differential Pair
515(1)
Measuring Even- and Odd-Mode Impedance
516(2)
Terminating Differential and Common Signals
518(7)
Conversion of Differential to Common Signals
525(5)
EMI and Common Signals
530(5)
Cross Talk in Differential Pairs
535(2)
Crossing a Gap in the Return Path
537(3)
To Tightly Couple or Not to Tightly Couple
540(2)
Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements
542(4)
The Characteristic Impedance Matrix
546(3)
The Bottom Line
549(2)
Appendix A 551(8)
Appendix B 559(12)
Appendix C 571(2)
Index 573(14)
About the Author 587

Excerpts

PrefacePrinted circuit-board and IC-package design used to be a field that involved expertise in layout, CAD, logic design, heat transfer, mechanical engineering, and reliability analysis. With modern digital electronic systems pushing beyond the 1-GHz barrier, packaging and board designers must now balance signal integrity and electrical performance with these other concerns.Everyone who touches the physical design of a product has the potential of affecting the performance. All designers should understand how what they do will affect signal integrity or, at the very least, be able to talk with engineers who are responsible for the signal integrity.The old design methodology of building prototypes, hoping they work, and then testing them to find out is no longer cost effective when time to market is as important as cost and performance. If signal integrity is not taken into account from the beginning, there is little hope a design will work the first time.In our new "high-speed" world, where the packaging and interconnect are no longer electrically transparent to the signals, a new methodology for designing a product right the first time is needed. This new methodology is based on predictability. The first step is to use established design guidelines based on engineering discipline. The second step is to evaluate the expected performance by "putting in the numbers." This is what distinguishes engineering from guesswork. It takes advantage of four important tools: rules of thumb, analytic approximations, numerical simulation tools, and measurements. With an efficient design and simulation process, many of the trade-offs between the expected performance and the ultimate cost can be evaluated early in the design cycle, where the time, risk, and cost savings will have the biggest impact. The way to solve signal integrity problems is to first understand their origin and then apply all the tools in our toolbox to find and verify the optimum solution.The design process is an intuitive one. The source of inspiration for a new way of solving a problem is that mysterious world of imagination and creativity. An idea is generated and the analytical powers of our technical training take over to massage the idea into a practical solution. Though computer simulations are absolutely necessary for final verification of a solution, they only rarely aid in our intuitive understanding. Rather, it is an understanding of the mechanisms, principles and definitions, and exposure to the possibilities, that contribute to the creation of a solution. Arriving at that initial guess and knowing the places to look for solutions require understanding and imagination.This book emphasizes the intuitive approach. It offers a framework for understanding the electrical properties of interconnects and materials that apply across the entire hierarchy from on-chip, through the packages, circuit boards, connectors, and cables.Those struggling with the confusing and sometimes contradictory statements made in the trade press will use this book as their starting place. Those experienced in electrical design will use this book as the place to finally understand what the equations mean.In this book, terms are introduced starting at the ground floor. For example, the impedance of a transmission line is the most fundamental electrical property of an interconnect. It describes what a signal will see electrically and how it will interact with the interconnects. For those new to signal integrity, most of the problems arise from confusion over three terms: the characteristic impedance, the impedance, and the instantaneous impedance a signal sees. This distinction is even important for experienced engineers. This book introduces the reader to each of these terms and their meanings, without complex mathematics.New topics are introduced at a basic level; most are not covered in other signal integrity books

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