CICMT 2005 - Ceramic Interconnect and Ceramic Microsystems Technologies CD-ROM Proceedings and Exhibitor Presentations held April 10-13, 2005, Baltimore, Maryland
by Ehlert, Mike; Ewsuk, KevinEdition: 1st
Format: CD
Pub. Date: 2005-09-28
Publisher(s): Wiley-American Ceramic Society
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Summary
This proceedings collection on CD-ROM is from the 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)held in April, 2005. This is a must-have resource for anyone involved in the Microelectronics field. Topics covered include Materials Solutions for Microsystems, Cofiring Processes, Microsystem Materials Integration, Dimensional Control in LTCC Systems, Ceramic Microsystem Applications and much more.
Author Biography
Mike Ehlert and Kevin Ewsuk are the authors of CICMT 2005 - Ceramic Interconnect and Ceramic Microsystems Technologies CD-ROM: Proceedings and Exhibitor Presentations held April 10-13, 2005, Baltimore, Maryland, published by Wiley.
Table of Contents
| Keynote Presentations | |
| Present and Future Challenges in Multilayer Ceramic Devices | |
| Current and Future Directions for Ceramic Interconnect | |
| Materials Process and Manufacturing: Current and Future Directions | |
| Materials Solution for Microsystems | |
| On-Board Fiber Alignment in LTCC Optoelectronic Packages | |
| Photosensitive Dielectric Paste for Micro-Patterning Technology in LTCC System | |
| Micro Channel Fabrication in LTCC Substrate | |
| Development and Evaluation of Hermetic Ceramic Microwave Packages for Space Applications | |
| Cofiring Processes | |
| Cofiring of Mixed LTCC Dielectric Laminates | |
| Modeling to Understand, Predict, and Control LTCC Tape Shrinkage and Density During Firing | |
| Densification and Crystallization of DuPont 943 Tape During Firing | |
| Microsystem Materials & Integration | |
| Integration Concepts for the Fabrication of LTCC Structures | |
| Development and Processing of an Anodic Bondable LTCC Tape | |
| Fabrication of LTCC Micro-Fludic Devices Using Sacrificial Carbon Layers | |
| LTCC Phase Shifter Modules for RF-MEMS-Switch Integration | |
| Dimensional Control in LTCC Systems | |
| Zero Shrinkage of LTCC by Self-Constrained Sintering | |
| Self-Constrained Sintering LTCC - A Reliable Solution for Automotive Electronic Application | |
| Via Fill for Zero X-Y Shrink LTCC Tapes | |
| Novel Self-Constrained Sintered Composites of Dielectric and Ferrite LTCC Tapes for Microwave Applications | |
| Keynote Presentation | |
| Ceramic Microstructure for Automotive Applications | |
| Ceramic Microsystems and Applications I | |
| Progress in MEMS and Micro Systems Research | |
| Miniaturized Sensor Elements Based on LTCC Technology for Automotive and Airborne Applications | |
| LTCC Sensors for Environmental Monitoring System | |
| Processing Integrated Passives IN LTCC | |
| Post-Thermal Heat Treatment for Adjusting Buried Resistor Values in DuPont 943 TM LTCC | |
| Magnetic Thin Film Technologies for Integrated Passives | |
| Characterization of Dried Thick-Film Resistors | |
| Methods to Improve Yield and Efficiency in Laser Trim of Embedded Components | |
| Ceramic Microsystems and Applications II | |
| Novel Microsystem Applications with New Techniques in LTCC | p. K.A. Peterson |
| Table of Contents provided by Publisher. All Rights Reserved. |
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